Plasma stripping machines are mainly used for processes such as wafer stripping or mask removal. They consist of a vacuum and pressure control system, a cylindrical quartz cavity reaction chamber, process gas and control system, a PLC control system, radio frequency and its matching system, etc.

The principle of the plasma degumming machine: In the quartz chamber, an appropriate amount of oxygen is introduced after vacuuming. In the high-frequency electromagnetic field created by the RF power supply, the oxygen is ionized into active plasmas such as O2-, O2+, O-, O+, oxygen atoms O, and ozone. The energy of oxygen atoms is very high. With the assistance of the high-frequency electric field, the photoresist on the substrate can be quickly oxidized to generate CO, CO2, H2O and other volatile oxides, which are extracted from the reaction chamber in the form of gas under vacuum to achieve the purpose of degumming.

Plasma debonding has the advantages of simple operation, high debonding efficiency, environmental protection, low cost, and a clean and smooth wafer surface without scratches after debonding. It plays an irreplaceable role in debonding and bottom film scanning processes.