NE-PE13F is a cost-effective dry degumming equipment that can be used for the activation and cleaning of sample surfaces of 8 inches and below. The working principle of plasma degumming is to place the epitaxial wafer/wafer covered with photoresist in a vacuum reaction system, introduce a small amount of oxygen, and use voltage discharge to ionize oxygen (O2) into excited oxygen atoms (O). Then the oxygen atoms react quickly with C and H in the resist to generate volatile gases such as CO, CO2 and H2O, which are pumped away by a vacuum pump to achieve the purpose of degumming. Plasma degumming is not only simple to operate, but also has high degumming efficiency. After degumming, the wafer surface is clean and smooth without scratches, low cost, and environmentally friendly, which is conducive to ensuring product quality.