The microwave plasma degumming machine NE-MW10 can be used for batch wafer degumming and removal of residual glue. It is designed for laboratory and R&D use. The equipment uses a 2.45GHz microwave plasma source to excite oxygen to a high-energy plasma state in a vacuum chamber and then bombard the photoresist, polyimide and other organic substances on the sample surface. The high-energy oxygen plasma can destroy the carbon-carbon bond, thereby reacting the adsorbed organic impurities into a gaseous state and detaching them from the surface. It can also form hydroxyl groups on the sample surface to achieve the purpose of cleaning and activation.

Microwave discharge is a technology that forms high-density plasma under low pressure. It has the characteristics of non-polar discharge, high density, high ionization degree, high activity, etc. It does not generate self-bias and will not cause damage to sensitive devices such as CMOS and MEMS.