NE-RE08 is a dry plasma stripping equipment, suitable for 2/4/6/8 inch wafer photoresist removal and ashing process. The equipment adopts high-density RIE plasma etching system, with fast stripping rate, good uniformity, high selectivity, good anisotropy and other performance advantages.

Product features: 1. The equipment adopts RIE reactive ion etching mode, with fast degumming rate. 2. Full-area process gas inlet spray head, radial (axisymmetric) exhaust structure, to ensure the improvement of process uniformity and rate. 3. Water-cooled electrode cooling system to achieve substrate temperature control. 4. Direct-open design for easy and fast loading and unloading.

Main uses: 1. Used for positive and negative photoresist stripping of 8-inch and below wafers (SOI, SI, glass, copper and other semiconductor materials). 2. Polyimide photoresist (PI) stripping. 3. Organic matter removal. 4. PR Descum primer process after photolithography process. 5. Plasma activation of substrate surface (02\Ar)