DESCRIPTION
Radio frequency plasma degumming machine is a kind of equipment specially used to remove the glue layer or polymer substance on the surface of the material. It uses the plasma generated by high-frequency electric field to carry out chemical reaction, converting various polymer substances into low-molecular substances that are easy to handle, thereby achieving the purpose of degumming. This process is usually called ashing process. Radio frequency plasma degumming technology is an efficient and environmentally friendly degumming method. It does not require the use of chemical solvents and water, and can effectively avoid pollution and waste disposal problems. RF plasma degumming machines usually include RF power supply, reaction chamber, gas control system and vacuum system. RF power supply is used to generate high-frequency electric field. The reaction chamber is the place where plasma is generated. The gas control system is used to control the type and flow of reaction gas. The vacuum system is used to maintain the low-pressure environment in the chamber to promote the formation of plasma and the progress of chemical reactions. There are several electrode plates built into the vacuum chamber of the equipment, which can be used for small-batch degumming to improve production efficiency.
The photoresist is bombarded and removed by gas ionization to ensure the integrity of the device. The RF plasma debonding machine is suitable for various substrates such as glass, metal seed layer, silicon wafer, piezoelectric ceramics, etc. Plasma bombardment can not only remove the residual glue on the surface, but also activate the substrate and improve its surface hydrophilicity.
PARAMETER
Model | NE-PE13FH |
Power | 0-300W adjustable |
Generator | RF 13.56 MHz, automatic impedance matching |
Chamber material | 316 Stainless Steel |
Chamber volume | 13.5L |
Chamber size | 240(L)*280(D)*200(H)mm |
Effective treatment area | 205(W)×205(D)×30.5(H)mm (8-inch wafer and below) |
Number of processing layers | 3 layers |
gas flow controller | MFC mass flow meter, 0-300ML |
Number of air paths | 2 channels (can be increased) |
Ultimate vacuum degree | 1PA |
Vacuum measuring system | Pirani vacuum silicon tube Measuring range 5×10 -2 ~1.0×10 5 Pa |
Vacuum pump | Dry pump/Oil pump (optional) |
Control system | PLC+touch screen |
Power supply | 220V |
Dimensions | 640mm(W)×665mm(D) ×580 mm(H) |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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