In-Line Lead Frame Plasma Cleaning System is primarily composed of loading/unloading mechanisms, pushing mechanisms, material transfer mechanisms, and vacuum chamber modules. It is designed for pre-cleaning processes in IC packaging, including die attachment (dispensing), wire bonding, and encapsulation, significantly enhancing adhesion strength and bonding reliability to optimize packaging yield.

Existing Chamber-Type Batch Plasma Cleaning Systems are predominantly batch-operated with low automation and production efficiency. Their design typically features a four-sided open cartridge structure with side panels on both sides, where workpieces are vertically stacked with spacing. During cleaning, shadowing effects caused by the cartridge sidewalls or insufficient spacing between adjacent workpieces (e.g., <5mm gaps) result in incomplete plasma exposure, preventing full coverage of all frame surface areas.

In-Line Sheet-Type Plasma Cleaning System utilizes a loading mechanism (robotic arm and conveyor belt) to individually extract lead frames from the cartridge and sequentially place them onto a flat carrier platform. The platform is then transferred into the cleaning chamber for plasma treatment. During the process, no obstructions exist on the front, top, or bottom sides of the lead frames, enabling full-surface plasma exposure for thorough and uniform cleaning. After cleaning, the unloading mechanism (robotic arm and conveyor belt) reloads the processed lead frames back into the cartridge, achieving significantly improved cleaning effectiveness and uniformity.