The NE-Q15 Inductively Coupled Plasma (ICP) Cleaner generates plasma by inducing gas in a quartz chamber using an RF power supply. Inductively coupled plasma maintains high plasma density even under lower gas pressure, reducing the bombardment of high-energy ions from the plasma source onto substrates. The equipment employs high-purity quartz glass as the reaction chamber, offering high cleanliness and no internal electrodes, thereby avoiding contamination caused by electrode sputtering.

Equipment Applications:  

1. Cleaning: Removal of organic substances, oxides, metal salts, nanoparticle contaminants, etc.  

2. Activation: Hydrophilic/hydrophobic modification, adhesion improvement, surface energy enhancement, functional group introduction, biocompatibility improvement, etc.  

3. Etching: Surface patterning, surface micro-etching, alteration of surface morphology and roughness, etc.  

4. Bonding: Bonding of PDMS-based microfluidic devices, pre-treatment for wafer bonding.  

5. Photoresist Removal: Photoresist ashing, residue cleaning.