The NE-PE65F is a vacuum plasma cleaning machine specifically designed for the semiconductor industry. As a dry cleaning equipment, the plasma cleaning process serves as a critical auxiliary step in precision cleaning for applications such as semiconductor manufacturing, thin/thick film circuits, component pre-packaging, and pre-chip bonding. This process enhances device performance and stability by removing contaminants and preparing surfaces at a microscopic level.

The equipment is constructed with mirror-polished stainless steel sheet metal, offering exceptional corrosion resistance and surface cleanliness. The electrode insulation components utilize ceramic electrode plate brackets, while chamber seals are made of fluorine-free materials to effectively prevent fluorine contamination within the chamber. Designed to meet the semiconductor industry's stringent high-cleanliness standards, the system's efficient removal of impurities significantly enhances product quality, achieves substantial improvements in process performance, and increases yield rates while ensuring superior product reliability.

Equipment Applications:  

1. Plasma cleaning prior to wire bonding – Ensures optimal surface conditions for reliable electrical connections.  

2. Plasma cleaning before molding – Removes contaminants to improve adhesion and encapsulation integrity.  

3. Plasma cleaning pre-underfill – Enhances bonding strength and void-free underfill performance.  

4. Photoresist descumming – Eliminates residual photoresist layers for precise lithography patterning.  

5. Surface roughening and etching – Modifies material surfaces to enhance bonding compatibility and adhesion.